Author Topic: Pan Pacific Microelectronics Symposium  (Read 17468 times)

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Pan Pacific Microelectronics Symposium
« on: November 06, 2012, 02:31:05 PM »
The Early Bird Registration Deadline for the 18th Annual Pan Pacific Microelectronics Symposium is December 17, 2012.  The event will take place January 22-24, 2013 at the Makena Beach and Golf Resort on Maui, Hawaii.  The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

The technical program will consist of sessions on Failure Analysis Tools and Techniques, Strategic Directions (Plenary), 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, and more.

There will be three Keynote Presentations, one at the end of each day of the symposium.  Rolf Aschenbrenner, Fraunhofer IZM, will make the first keynote when he presents "Panel Level Packaging- Manufacturing Solution for Cost Effective Solution" on Tuesday evening.  Chrys Shea, Shea Engineering Services, is the Wednesday evening Keynote and she will present, "Communicating Technical Topics: Strategies for Success."  Hajime Tomokage, Ph.D., Fukuoka University, will close the symposium with a presentation on Embedded Device Technology.

View the complete program and register at the website: http://www.smta.org/panpac.  Please contact JoAnn Stromberg, [email protected] or 952-920-7682, with questions.